ghd deutschland Foreign Military microwave vacuum

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Foreign Military microwave vacuum electronic devices with key materials

. 27 thermal expansion deposited (X10-'/' c) 4.54.34.54.544.19 (RT ~ 400 ℃) thermal conductivity (w, m ・ K) 10O ~ 17016022O10017Ol40 ~ 17 (volume resistivity (fl ・ cm)> 1O \.5 ~ 1O.51l0.3 ~ l2 bending strength (X10Pa) 39227 ~ 4903349033490332432329420 ~ 39227 Breakdown Strength (kV / mm) l4 ~ 17H ~ 173015> 10 high thermal conductivity ceramic thermal conductivity of not only higher, and the resistivity also high, which can be said that the direction of development. this regard, the heat 'electric thousands of materials} 8 ~ 9, 1994, Volume 7 conductivity of SiC, BeC and AIN is a good lip on the preferred list. of course , BeO has a high toxicity, the use of proper protective measures in the plot. Comparison of several materials indiscriminately thermal conductivity Bong (w ・ In, K_.) store various materials 8, thermal conductivity and resistivity of only five more than the relationship between Class material is introduced,[link widoczny dla zalogowanych], in fact, the demand for vacuum electronic devices electronic new material has a lot of the key. of several materials of the above problems in the device more, the level of difference between the larger and abroad, and thus all the more urgent and more necessary received from abroad reference. Main Reference 1 edge wells and other macro. copper on the copper Taijin excluded. {metal), see the construction of the new Long 19930:292 other. Cu-based ODS alloy development trends lip>,[link widoczny dla zalogowanych], 1992,[link widoczny dla zalogowanych],5:293 rice Kubota Zhiren. ODS alloy practical trends {metal>, 1992,5:524 Tang and Chen. foreign metal functional material development trends. \Materials Technology Association Delegation academic exchanges fourth lecture, Tsinghua University in Beijing, 6 high 1994,[link widoczny dla zalogowanych],5.6 Long Bridge. Ti-Ag-cu activity of the new progress solder alloy. {Vacuum Electronics Letters \10t227 Kong Baijian translation. CHAN slightly from school. high-brightness electron beam source of hot electrons. {vacuum electronics technique \, 4 (I994 Fung Received May 23) can be used in Finland to develop a new type of microwave absorbing stealth materials Fen Lan Finnyards Material Co., Ltd. has developed a special operation in harsh weather conditions of the marine environment and the use of new high-performance microwave Ai received HPA-1 material. It does not promote the election can be applied to the Navy anti-mine projects, but also can be applied to those exposed to adverse weather conditions, the request must make a large microwave signal attenuation outdoor facilities. patrol in the northern waters of Finland Navy ships are now equipped with the latest on this anti-radar technology sneeze body 1HPA HPA-1 a multi-layer polymer materials technology. can provide good absorption performance of micro transition. and the stack is compared to - to a large reflection loss l5 to 2SdB or more, in the 5 to 18GHz frequency range fIj, can provide this warm yield performance. and according to specific application requirements - by changing the polymer resin used to make the absorption rate of electromagnetic properties to achieve the best performance good. In order to in extremely harsh ocean and climate conditions can still provide a stable performance, HPA-1 arm of the village received election materials to mute wave capacity (electrical resistance vessels) and in the harsh environment of the survival of the ship split force (mechanical properties) combines. in the primary use of glass materials can provide additional enhanced pull strength t and not worry about overweight. HPA-1 material per square meter weight of not more than 6kg. provided HPA-1 material is laminated in rigid metal or pre- tiles. both can be made into a standard flat. You can also pre-press requirements. prefabricated parts in the processing of materials out of the production process as appropriate. HPA-1 materials, the installation can be completed with standard tools,[link widoczny dla zalogowanych], mechanical fasteners or rings can be used epoxy resin, the HPA-1 material is attached to the disk structure. HPA-1 microwave absorbing materials and other materials, a major difference is that, HPA-1 material does not require it to be attached to the structure of the surface is completely smooth. It's microwave absorption performance and related support materials. (Xu Feng Su AP) .8. \ More articles related to topics：

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