Strona glówna
•
FAQ
•
Szukaj
•
Użytkownicy
•
Grupy
•
Galerie
•
Rejestracja
•
Profil
•
Zaloguj się, by sprawdzić wiadomości
•
Zaloguj
Forum Forum MESA !! Strona Główna
->
Korona Kielce
Napisz odpowiedź
Użytkownik
Temat
Treść wiadomości
Emotikony
Więcej Ikon
Kolor:
Domyślny
Ciemnoczerwony
Czerwony
Pomarańćzowy
Brązowy
Żółty
Zielony
Oliwkowy
Błękitny
Niebieski
Ciemnoniebieski
Purpurowy
Fioletowy
Biały
Czarny
Rozmiar:
Minimalny
Mały
Normalny
Duży
Ogromny
Zamknij Tagi
Opcje
HTML:
TAK
BBCode
:
TAK
Uśmieszki:
TAK
Wyłącz HTML w tym poście
Wyłącz BBCode w tym poście
Wyłącz Uśmieszki w tym poście
Kod potwierdzający: *
Wszystkie czasy w strefie EET (Europa)
Skocz do:
Wybierz forum
Nabór do ZESPÓŁ Forum MESA
----------------
Nabór
MESA - DRUŻYNY
----------------
GKS Bełchatów
Cracovia Kraków
Dyskobolia Grodzisk Wielkopolski
Górnik Zabrze
Jagiellonia Białystok
Korona Kielce
Lech Poznań
Legia Warszawa
ŁKS Łódź
Odra Wodzisław Śląski
Polonia Bytom
Ruch Chorzów
Wisła Kraków
Zagłębie Lubin
Zagłębie Sosnowiec
MESA - OGÓLNIE
----------------
Regulamin
Terminarz
Sędziowie
Wyniki
DLA KIBICA
----------------
Typer
Rozrywka
Sonda
INNE
----------------
Hydepark
Reklama
PARTNERZY
----------------
Parnerzy w reklamie i realizacji projektu !!
Przegląd tematu
Autor
Wiadomość
wee960t2e
Wysłany: Nie 4:18, 13 Mar 2011
Temat postu: for its important position in the region, and was
Chip silicon substrate electrode can be two kinds of contact methods,
led message sign
, namely L exposure (Laterial-contact, the level of exposure) and the V exposure (Vertical-contact, vertical contact), hereafter referred to as L-type electrode and V-type electrode. By these two means of contact, LED chip current flow can be horizontal, or vertical movement. Since current can flow vertically, thus increasing the LED light-emitting area, thereby improving the extraction efficiency of LED.
Because silicon is a good conductor of heat, so the device can be significantly improved thermal performance, thus extending the life of the device. SiC substrate SiC substrates (CREE company specializes in the United States as a substrate material using SiC) LED chip electrode is L-type electrode, current is the longitudinal flow.
Devices made using this substrate conductivity and thermal conductivity are very good, is conducive to high-power devices made larger. LED chips using silicon carbide substrate shown in Figure 2. Thermal conductivity of SiC substrate (SiC the thermal conductivity of 490W / (m?; K)) than in more than 10 times higher than the sapphire substrate. Sapphire itself is a poor conductor of heat, and in the production of the device need to use the silver plastic while the bottom of the solid crystal, silver plastic that the heat transfer performance is also poor.
Chips using silicon carbide substrates for the L-type electrodes, two electrodes located in the surface and bottom of the device, the heat generated can be exported through the electrode; the same time that the substrate does not require conductive layer,
portable displays
, and therefore will not be current photo diffusion layer of material absorption, which also enhance the light extraction efficiency.
But relative to the sapphire substrate,
Budweiser sign
, the silicon carbide manufacturing costs higher, to achieve its commercial also need to reduce the corresponding costs. Performance comparison of three kinds of substrate in front of An Introduction to the LED chip is made of three commonly used substrates.
These three substrates comprehensive performance comparison shown in Table 1. In addition to these three common substrate materials, there GaAS, AlN,
display boards
, ZnO and other materials can also be used as a substrate, usually need to choose according to the design. Evaluation of substrate 1. Substrates and epitaxial films of structural matching: epitaxial materials and substrates on the crystal structure of the same or similar, the lattice constant mismatch is small, crystalline properties, and defect density is low;
fora.pl
- załóż własne forum dyskusyjne za darmo
Theme
FrayCan
created by
spleen
&
Download
Powered by
phpBB
© 2001, 2005 phpBB Group
Regulamin